Dell PowerEdge R670 Server

Tech Specs

• Base:
  PowerEdge R670 Server
• Form Factor:
  1U Rack Server
• Processor:
  Two Intel Xeon 6 Processors with up to 144 cores or 86 P-cores per processor
• Power Supplies:
  800 W Platinum/Titanium 100—240 VAC or 240 VDC
  1100 W Platinum/Titanium 100—240 VAC or 240 VDC
  1400 W LVDC -48 — -60 VDC
  1500 W Titanium 100—240 VAC or 240 VDC
  1500 W 277 VAC or 336 VDC
  1800 W HLAC Titanium 200—240 VAC or 240 VDC
• Memory:
  32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 6400 MT/s
  Supports registered ECC DDR5 DIMMs only
• Storage Controllers:
  Internal Controllers:
  Front PERC H965i, Front PERC H975i, Front PERC H365i
  
  Boot Optimized Storage Subsystem (BOSS-N1):
  HWRAID 1, 2 x M.2 NVMe SSDs, M.2 interposer with up to 2 x M.2 NVMe SSDs or USB
• Drive Bays:
  Front Bays:
  No Backplane configuration
  Up to 8 x EDSFF E3.S NVMe (SSD) max 122.88 TB also with FIO configuration
  Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) max 245.76 TB
  Up to 20 x EDSFF E3.S Gen5 NVMe (SSD) max 307.2 TB
  Up to 8 x 2.5 inch SAS/SATA/NVMe Direct/NVMe Raid (SSD) max 122.88 TB
  8 x 2.5-inch Universal 245.6 TB
  Up to 10 x 2.5 inch SAS/SATA (SSD) max 38.4 TB
  
  Rear Bays:
  Up to 2 x EDSFF E3.S Gen5 NVMe (SSD) max 30.72 TB
• Dimensions:
  Height – 42.8 mm (1.69 inches)
  Width – 482 mm (18.98 inches)
  Weight – 20.42 kg (45.02 pounds)
  Depth with bezel (for rear I/O configuration) – 816.92 mm (32.20 inches)
  Depth without bezel (for rear I/O configuration) – 815.14 mm (32.09 inches)
  Depth without bezel (for front I/O configuration) – 829.44 mm (32.66 inches)
• Embedded Management:
  iDRAC
  iDRAC Direct
  iDRAC RESTfull API with redfish
  RACADM CLI
  iDRAC Service Module
  NativeEdge Endpoint
  NativeEdge Orchestrator
• Security:
  Cryptographically signed firmware
  Data at Rest Encryption (SEDs with local or external key mgmt)
  Secure Boot
  Secured Component Verification (Hardware integrity check)
  Secure Erase
  Silicon Root of Trust
  System Lockdown (requires iDRAC10 Enterprise or Datacenter)
  TPM 2.0 FIPS, CC-TCG certified
  Chassis Intrusion Detection
• Network options:
  Up to four OCP NIC 3.0 cards (optional) and 1GbE, 10GbE, 25GbE, 100GbE and 400GbE
• GPU Options:
  Up to 3 x 75 W SW
• Ports:
  Front Ports:
  1 x USB 2.0 Type C port
  1 x USB 2.0 Type A port (optional)
  1 x Mini-DisplayPort (optional)
  1 x DB9 Serial (with front I/O configuration)
  1 x Dedicated Ethernet port for iDRAC management
  
  Rear Ports:
  1 x Dedicated ethernet port for iDRAC management
  2 x USB 3.1 Type A ports
  1 x VGA
  
  Internal:
  1 x USB 3.1 Type A port
• PCIe:
  Up to 2 x 16 Gen5 PCIe slots
  Slot 31 1 x 16 Full Height - Half Length or Full Height - Full Length or 1 x 16 OCP 3.0 on front riser
  Slot 32 1 x 16 Full Height - Half Length or Full Height - Full Length or 1 x 16 OCP 3.0 on front riser
  Up to 3 x 16 or 2 x 8 Gen5 PCIe slots
  Slot 1 1 x 16 Full Height - Half Length or Full Height - Full Length or 3 x 16 or 1 x 8 Low Profile - Half Length
  Slot 2 1 x 16 or 1 x 8 Low Profile - Half Length or 1 x 16 OCP 3.0
  Slot 4 1 x 16 Full Height - Half Length or 1 x 16 Low Profile - Half Length
• Fans:
  High performance Silver (HPR SLVR) or Standard (STD) fans
  Up to 4 sets (dual fan module) hot swappable fans
• Cooling Options:
  Air cooling and Direct Liquid Cooling
  Note : DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate.
• Bezel:
  Optional security bezel
• Operating Systems & Hypervisors:
  Canonical Ubuntu Server LTS
  Microsoft Windows Server with Hyper-V
  Red Hat Enterprise Linux
  SUSE Linux Enterprise Serve
  VMware ESXi